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INTEGRATED CIRCUITS
DATA SHEET
SAA7167 YUV-to-RGB Digital-to-Analog Converter (DAC)
Preliminary specification Supersedes data of 1995 Jun 13 File under Integrated Circuits, IC22 1995 Nov 03
Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
FEATURES * On-chip mixing of digital video data and analog RGB signals * Supports video input format of YUV 4 : 2 : 2, 4 : 1 : 1, 2 : 1 : 1 andRGB 5 : 6 : 5 * Video input rate up to 50 MHz * Allows for both binary and two's complement video input data * Triple 8-bit DACs for video output * Built-in voltage output amplifier * Provide keying control with external key and internal 8-bit, 2 x 8-bit and 3 x 8-bit pixel colour key * Programmable via the I2C-bus * 5 V CMOS device; LQFP48 package. GENERAL DESCRIPTION The SAA7167 is a mixed-mode designed IC containing a video data path, keying control block, analog mixer, and a QUICK REFERENCE DATA SYMBOL VDDD VDDA Tamb digital supply voltage analog supply voltage operating ambient temperature PARAMETER MIN. 4.75 4.75 0
SAA7167
voltage output amplifier, capable of converting digital video data to analog RGB video, and then mixing video and external analog RGB inputs. The video data path contains a data re-formatter, YUV-to-RGB colour space matrix as well as triple DACs for video data processing. An analog mixer performs multiplexing between DAC outputs of the video path and external analog RGB inputs. The final analog outputs are buffered with built-in voltage output amplifiers to provide the direct driving capability for a 150 load. Figure 1 shows the overall block diagram. The operation of SAA7167 is controlled via the I2C-bus.
MAX. 5.25 5.25 70 V V
UNIT
C
ORDERING INFORMATION TYPE NUMBER SAA7167 PACKAGE NAME LQFP48 DESCRIPTION plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm VERSION SOT313-2
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Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
BLOCK DIAGRAM
SAA7167
handbook, full pagewidth
Cref(h) 36
Bin Gin Rin 29 31 33 MIXER OPAMP 32 Rout
YUV7 to YUV0
38 to 45 REFORMATTER YUV TO RGB MATRIX MUX 8-BIT DAC (3x) MIXER OPAMP 30 Gout
UV7 to UV0
46 to 48, 1 to 5 9
HREF
MIXER
OPAMP 28
Bout
SDA SCL RES
22 23 24 I2C-BUS CONTROL
SAA7167
CLOCK GENERATOR
KEYING CONTROL
8 6 VCLK 10 PCLK 21 EXTKEY 13 to 20
MGB743
P7 to P0
Fig.1 Block diagram.
1995 Nov 03
3
Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
PINNING SYMBOL UV4 UV3 UV2 UV1 UV0 VCLK VDDD VSSD HREF PCLK AP SP P7 P6 P5 P4 P3 P2 P1 P0 EXTKEY SDA SCL RES n.c. VSSA2 VDDA2 Bout Bin Gout Gin Rout Rin VSSA1 VDDA1 Cref(h) 1995 Nov 03 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 DESCRIPTION
SAA7167
I/O I I I I I I I/O I/O I I I I I I I I I I I I I I/O I I - I/O I/O O I O I O I I/O I/O I/O
digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R input data digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R input data digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R input data digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R input data digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R input data video clock input digital supply voltage digital ground horizontal reference input signal pixel clock input test pins, normally connected to ground test pins, normally connected to ground pixel bus input 7 (for keying control) pixel bus input 6 (for keying control) pixel bus input 5 (for keying control) pixel bus input 4 (for keying control) pixel bus input 3 (for keying control) pixel bus input 2 (for keying control) pixel bus input 1 (for keying control) pixel bus input 0 (for keying control) external key signal input I2C-bus data line I2C-bus clock line set to LOW to reset the I2C-bus not connected analog ground 2 analog supply voltage 2 analog Blue signal output analog Blue signal input analog Green signal output analog Green signal input analog Red signal output analog Red signal input analog ground 1 analog supply voltage 1 capacitor for reference high voltage output (2.25 V) 4
Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
SYMBOL n.c. YUV7 YUV6 YUV5 YUV4 YUV3 YUV2 YUV1 YUV0 UV7 UV6 UV5 PIN 37 38 39 40 41 42 43 44 45 46 47 48 not connected DESCRIPTION
SAA7167
I/O - I I I I I I I I I I I
digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R input data digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R input data digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R input data
38 YUV7
41 YUV4
45 YUV0
40 YUV5
39 YUV6
42 YUV3
44 YUV1
43 YUV2
46 UV7
48 UV5
47 UV6
index corner
37 n.c.
UV4 UV3 UV2 UV1 UV0 VCLK VDDD VSSD HREF
1 2 3 4 5 6 7 8 9
36 Cref(h) 35 VDDA1 34 VSSA1 33 Rin 32 Rout
SAA7167
31 Gin 30 Gout 29 Bin 28 Bout 27 VDDA2 26 VSSA2 25 n.c.
PCLK 10 AP 11 SP 12
EXTKEY 21
SDA 22
RES 24
P7 13
P6 14
P5 15
P4 16
P3 17
P2 18
P1 19
P0 20
SCL 23
MGB744
Fig.2 Pin configuration.
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Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
FUNCTIONAL DESCRIPTION The SAA7167 contains a video data path, 3 analog mixers and voltage output amplifiers for the RGB channels respectively, a keying control block as well as an I2C-bus control block. Video data path The video data path includes a video data re-formatter, a YUV-to-RGB colour space conversion matrix, and triple 8-bit DACs. RE-FORMATTER The re-formatter de-multiplexes the different video formats YUV 4 : 1 : 1, 4 : 2 : 2 or 2 : 1 : 1 to internal YUV 4 : 4 : 4, which can then be processed by the RGB matrix. The pixel byte sequences of those video input formats are shown in Tables 1 to 4. Table 1 Pixel byte sequence of 4 : 2 : 2 PIXEL BYTE SEQUENCE OF 4:2:2 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 U0 U1 U2 U3 U4 U5 U6 U7 0 0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 V0 V1 V2 V3 V4 V5 V6 V7 1 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 U0 U1 U2 U3 U4 U5 U6 U7 2 2 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 V0 V1 V2 V3 V4 V5 V6 V7 3 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 U0 U1 U2 U3 U4 U5 U6 U7 4 4 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 V0 V1 V2 V3 V4 V5 V6 V7 5 Table 2 INPUT
YUV0 YUV1 YUV2 YUV3 YUV4 YUV5 YUV6 YUV7 UV0 UV1 UV2 UV3 UV4 UV5 UV6
SAA7167
Pixel byte sequence of 4 : 1 : 1 PIXEL BYTE SEQUENCE OF 4 : 1 : 1 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X X X X V6 V7 U6 U7 0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X X X X V4 V5 U4 U5 1 0 Pixel byte sequence of 2 : 1 : 1 PIXEL BYTE SEQUENCE OF 2 : 1 : 1 U0 U1 U2 U3 U4 U5 U6 U7 X 0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 0 X V0 V1 V2 V3 V4 V5 V6 V7 X 0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 2 X U0 U1 U2 U3 U4 U5 U6 U7 X 4 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 4 X V0 V1 V2 V3 V4 V5 V6 V7 X 4 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 6 X Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X X X X V2 V3 U2 U3 2 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X X X X V0 V1 U0 U1 3 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X X X X V6 V7 U6 U7 4 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X X X X V4 V5 U4 U5 5 4 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X X X X V2 V3 U2 U3 6 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X X X X V0 V1 U0 U1 7
INPUT
YUV0 (LSB) YUV1 YUV2 YUV3 YUV4 YUV5 YUV6 YUV7 (MSB) UV0 (LSB) UV1 UV2 UV3 UV4 UV5 UV6 UV7 (MSB) Y data UV data
UV7 Y data UV data
Table 3 INPUT
YUV0 YUV1 YUV2 YUV3 YUV4 YUV5 YUV6 YUV7 Y data UV data
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Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
Table 4 Pixel byte sequence of 5 : 6 : 5 PIXEL BYTE SEQUENCE OF RGB 5:6:5 G0 R4 R3 R2 R1 R0 G5 G4 G3 G2 G1 B4 B3 B2 B1 B0 0 G0 R4 R3 R2 R1 R0 G5 G4 G3 G2 G1 B4 B3 B2 B1 B0 1 G0 R4 R3 R2 R1 R0 G5 G4 G3 G2 G1 B4 B3 B2 B1 B0 2 G0 R4 R3 R2 R1 R0 G5 G4 G3 G2 G1 B4 B3 B2 B1 B0 3 110 2 x 8-bit pixel Analog mixers and keying control
SAA7167
INPUT
UV7 UV6 UV5 UV4 UV3 UV2 UV1 UV0 YUV7 YUV6 YUV5 YUV4 YUV3 YUV2 YUV1 YUV0 RGB data
The analog mixers are controlled to switch between the outputs from the video DACs and analog RGB inputs by a keying signal. The analog RGB inputs need to interface with analog mixers in the way of DC-coupling, also these RGB inputs are limited to RGB signals without a sync level pedestal. The keying control can be enabled by setting I2C bit KEN = 1. Two kinds of keying are possible to generate: one is external key (from EXTKEY pin when KMOD2 to KMOD0 are logic 0), and the other is the internal pixel colour key (when KMOD2 to KMOD0 are not logic 0) generated by comparing the input pixel data with the internal I2C-bus register value KD7 to KD0. Controlled by KMOD2 to KMOD0 bits, there are 4 ways to compare the pixel data (see Table 5). Table 5 KMOD2 to KMOD0 PIXEL TYPE 8-bit pixel 2 x 8-bit pixel REMARK pseudo colour mode high colour mode 1 with pixels given at both rising and falling edges of PCLK high colour mode 2 with pixels given only at rising edges of PCLK true colour mode
KMOD2 to KMOD0 100 101
For RGB 5 : 6 : 5 video inputs, the video data are just directly bypassed to triple DACs. The input video data can be selected to either two's complement (I2C-bus DRP-bit = 0) or binary offset (DRP-bit = 1). The video input format is selected by I2C-bus bits FMTC1 and FMTC0. The rising edge of HREF input defines the start of active video data. When HREF is inactive, the video output will be blanked. YUV-TO-RGB MATRIX The matrix converts YUV data, in accordance with CCIR-601, to RGB data with approximately 1.5 LSB deviation to the theoretical values for 8-bit resolution. TRIPLE 8-BIT DACS Three identical DACs for R, G and B video outputs are designed with voltage-drive architecture to provide high-speed operation of up to 50 MHz conversion data rate. A Cref(h) pin is provided to allow for one external de-coupling capacitor to be connected between the internal reference voltage source and ground.
111
3 x 8-bit pixel
Since only one control register KD7 to KD0 provides the data value for pixel data comparison, when at 2 x 8-bit or 3 x 8-bit pixel input modes, it is presumed that all input bytes (lower, middle, or higher) of each pixel must be same as KD7 to KD0 in order to make graphics colour key active. The polarity of EXTKEY can be selected with KINV. With KINV = 0, EXTKEY = HIGH switches analog mixers to select DAC outputs. Before the internal keying signal switches the analog multiplexers, it can be further delayed up to 7 PCLK cycles with the control bits KDLY2 to KDLY0.
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Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
Voltage output amplifiers Before the analog input enters the analog mixers, it passes through voltage output amplifiers. Level shifters are used internally to provide an offset of 0.2 V and an amplifier gain of 2 for analog inputs to match with the output levels from DACs. After buffering with voltage output amplifiers, the final RGB outputs can drive a 150 load directly (25 internal resistor, 50 external serial resistor, and 75 load resistor at monitor side (see Fig.9). The output voltage level of DAC ranges from the lowest level 0.2 V (zero code) to the highest level 1.82 V (all one code). Table 6 S Notes 1. S = START condition. I2C-bus format slave address A subaddress A data A
SAA7167
With the digital input YUV video data in accordance with CCIR-601, the RGB output of 8-bit DAC actually ranges from the 16th step (black) to the 235th step (white). Therefore, after the voltage divider with external serial resistor and monitor load resistor, the output voltage range to monitor is approximately 0.7 V (peak-to-peak). I2C-bus control Only one control byte is needed for the SAA7167. The I2C-bus format is shown in Table 6.
P
2. Slave address = 1011 111X; this slave address is identical to the one for the SAA9065; X = R/W control bit: a) X = 0; order to write. b) X = 1; order to read (not used for SAA7167). 3. A = acknowledge; generated by the slave. 4. Subaddress = subaddress byte. 5. Data = data byte. 6. P = STOP condition. Table 7 Control data byte D7 KMOD2 0 KD7 D6 KMOD1 0 KD6 D5 KMOD0 0 KD5 D4 DRP 0 KD4 D3 KEN 0 KD3 D2 KINV KDLY2 KD2 D1 FMTC1 KDLY1 KD1 D0 FMTC0 KDLY0 KD0
SUBADDRESS 00 01 02
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Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
Table 8 Bit functions in data byte; notes 1 and 2 BIT FMTC1 and FMTC0 video format control: 00; YUV 4 : 2 : 2 01; YUV 4 : 1 : 1 10; YUV 2:1:1/CCIR 656 11; RGB 5 : 6 : 5 KINV key polarity: DESCRIPTION
SAA7167
KINV = 0: EXTKEY = HIGH for analog mixer to select DAC outputs KINV = 1: EXTKEY = HIGH for analog mixer to select analog RGB inputs KEN key enable: 0 = disable 1 = enable DRP KMOD2 to KMOD0 UV input data code: 0 = two's complement; 1 = binary offset keying mode: 000; external key 100; 8-bit pixel colour key 101; 2 x 8-bit pixel colour key (with two-edge clock latching for pixel input) 110; 2 x 8-bit pixel colour key (with one-edge clock latching for pixel input) 111; 3 x 8-bit pixel colour key (with one-edge clock latching for pixel input) all other combinations are reserved KDLY2 to KDLY0 KD7 to KD0 Notes 1. All I2C-bus control bits are initialized to logic 0 after RES is activated. 2. PCLK should be active in any event to allow for correct operation of I2C-bus programming. DC CHARACTERISTICS Tamb = 0 to 70 C. SYMBOL VDDD VDDA IDDtot VIH VIL VIH VIL Vin Vout DNL INL 1995 Nov 03 PARAMETER digital supply voltage analog supply voltage total supply current (fclk = 50 MHz) HIGH level input voltage (pin SDA) LOW level input voltage (pin SDA) HIGH level digital input voltage LOW level digital input voltage full-scale analog RGB inputs full scale analog RGB outputs (for 150 load) differential non-linearity error of video output integral non-linearity error of video output 9 MIN. 4.75 4.75 - 3 -0.5 2 - - - - - TYP. 5.0 5.0 100 - - - - 0.7 1.4 - - MAX. 5.25 5.25 - VDDD + 0.5 +1.5 - 0.8 - - 1 1 V V mA V V V V V V LSB LSB UNIT added keying delay cycles (from 0 to 7 PCLK) the data value compared for 8, 16 or 24-bit pixel colour key
Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
AC CHARACTERISTICS Tamb = 0 to 70 C. SYMBOL fclk PCLK video clock rate duty factor of VCLK pixel clock rate (8-bit pixel colour key); see Fig.4 pixel clock rate (2 x 8-bit pixel colour key; mode 1); see Fig.5 pixel clock rate (2 x 8-bit pixel colour key; mode 2); see Fig.6 pixel clock rate (3 x 8-bit pixel colour key); see Fig.7 duty factor of PCLK tsu1 th1 tsu2 th2 tsu3 th3 tsw Tgroup digital input set-up time to VCLK rising edge digital input hold time to VCLK rising edge digital input set-up time to PCLK rising edge digital input hold time to PCLK rising edge digital input set-up time to PCLK falling edge digital input hold time to PCLK falling edge switching time between video DAC/analog inputs; note 1 overall group delay from digital video inputs to analog outputs (see Fig.8): YUV video input mode RGB video input mode tr tf ts tPD DAC analog output rise time (see Fig.8); note 2 DAC analog output fall time (see Fig.8); note 2 DAC analog output settling time (see Fig.8); note 3 DAC analog output propagation delay (see Fig.8); note 4 - - - - - - 20TVCLK + tPD 12TVCLK + tPD 5 5 - 15 - - - - 15 - PARAMETER - - - - - - 40 3 3 3 3 3 3 - MIN. - 50 - - - - 50 - - - - - - - TYP. - 50 40 80 75 60 - - - - - - 15
SAA7167
MAX. 50 %
UNIT MHz MHz MHz MHz MHz % ns ns ns ns ns ns ns
ns ns ns ns ns ns
Analog outputs from analog inputs Gv B SR Notes 1. Switching time measured from the 50% point of the EXTKEY transition edge to the 50% point of the selected analog output transition. 2. DAC output rise/fall time measured between the 10% and 90% points of full scale transition. 3. DAC settling time measured from the 50% point of full-scale transition to the output remaining within 1 LSB. 4. DAC analog output propagation delay measured from the 50% point of the rising edge of VCLK to the 50% point of full-scale transition. voltage gain bandwidth (-3 dB) slew rate - - - 2.0 75 90 - - - MHz V/s
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Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
SAA7167
handbook, full pagewidth
VCLK tsu1 HREF
th1
YUV tsu1 UV
MGB745
Fig.3 Video data input timing.
handbook, full pagewidth
PCLK tsu2 th2 P7 to P0 pixel 1 pixel 2 pixel 3 pixel 4 pixel 5 pixel 6 pixel 7
MGB746
Fig.4 Pixel data timing; 8-bit pixel colour key.
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Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
SAA7167
handbook, full pagewidth
PCLK
tsu2 th2 P7 to P0
tsu3 th3
pixel 1
pixel 2
pixel 3
MGB747
Fig.5 Pixel data input timing; 2 x 8-bit pixel colour key; mode 1.
handbook, full pagewidth
PCLK tsu2 th2 P7 to P0
pixel 1
pixel 2
pixel 3
MGB748
Fig.6 Pixel data input timing; 2 x 8-bit pixel colour key; mode 2. 1995 Nov 03 12
Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
SAA7167
handbook, full pagewidth
PCLK tsu2 th2 P7 to P0
pixel 1
pixel 2
MGB749
Fig.7 Pixel data input timing; 3 x 8-bit pixel colour key.
handbook, full pagewidth
VCLK
Tgroup
YUV and UV
(full-scale transition) ts tPD
Rout, Bout and Gout
tr; tf
MGB750
Fig.8 DAC output timing.
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Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
APPLICATION INFORMATION
SAA7167
handbook, full pagewidth
digital YUV video data inputs 8 38 to 45 YUV7 to YUV0 8 UV7 to UV0 analog inputs from VGA Rin 75 33 SAA7167 Gin 75 47 31 30 Gout 75 32 Rout 75 46 to 48, 1 to 5 36 Cref(h) 0.1 F
to PC monitor 47
Bin 75
47 29 28 Bout 75
MGB751
cable
monitor side
Fig.9 Typical application diagram for analog circuits.
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Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
PACKAGE OUTLINE LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SAA7167
SOT313-2
c
y X
36 37
25 24 ZE
A
e
Q E HE A A2 A1 (A 3) Lp L detail X
wM pin 1 index 48 1 12 ZD bp D HD wM B vM B vM A 13 bp
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT313-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A max. 1.60 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 7.1 6.9 E (1) 7.1 6.9 e 0.5 HD 9.15 8.85 HE 9.15 8.85 L 1.0 Lp 0.75 0.45 Q 0.69 0.59 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 0.95 0.55 0.95 0.55 7 0o
o
ISSUE DATE 93-06-15 94-12-19
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Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all LQFP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering is not recommended for LQFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
SAA7167
If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. Even with these conditions, do not consider wave soldering LQFP packages LQFP48 (SOT313-2), LQFP64 (SOT314-2) or LQFP80 (SOT315-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
SAA7167
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
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Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
NOTES
SAA7167
1995 Nov 03
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Philips Semiconductors
Preliminary specification
YUV-to-RGB Digital-to-Analog Converter (DAC)
NOTES
SAA7167
1995 Nov 03
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Philips Semiconductors - a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40-2783749, Fax. (31)40-2788399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil. P.O. Box 7383 (01064-970), Tel. (011)821-2333, Fax. (011)829-1849 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS: Tel. (800) 234-7381, Fax. (708) 296-8556 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. (852)2319 7888, Fax. (852)2319 7700 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (032)88 2636, Fax. (031)57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (358)0-615 800, Fax. (358)0-61580 920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: P.O. Box 10 63 23, 20043 HAMBURG, Tel. (040)3296-0, Fax. (040)3296 213. Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)7640 000, Fax. (01)7640 200 Italy: PHILIPS SEMICONDUCTORS S.r.l., Piazza IV Novembre 3, 20124 MILANO, Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, Tel. (03)3740 5130, Fax. (03)3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)709-1412, Fax. (02)709-1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. (040)2783749, Fax. (040)2788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546 Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. Antonio Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)4163160/4163333, Fax. (01)4163174/4163366 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430, Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494 Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. (01)488 2211, Fax. (01)481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (66) 2 745-4090, Fax. (66) 2 398-0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. (0 212)279 27 70, Fax. (0212)282 67 07 Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165, 252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991 United Kingdom: Philips Semiconductors LTD., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. (0181)730-5000, Fax. (0181)754-8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601
Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-2724825 SCD45 (c) Philips Electronics N.V. 1995
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
483061/1100/01/pp20 Document order number: Date of release: 1995 Nov 03 9397 750 00416

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